국방대학교 도서관검색
- Home
- 기능목록
- 검색
-
Marc 보기
MARC 닫기
-
LDR
00000cam c22002058c 4500
-
001
000005113843
-
005
20230227153616
-
008
220510s2022 us b 001c0 eng
-
010
▼a 2021031791
-
020
▼a 9781032160818
▼q (hbk) -
035
▼a (KERIS)REF000019691950
-
040
▼a DLC
▼b eng
▼c DLC
▼d 211070 -
042
▼a pcc
-
050
▼a TK7870.15
-
090
▼a TK7870.15
▼b C399 -
245
▼a Thermal and structural electronic packaging analysis for space and extreme environments /
▼d Juan Cepeda-Rizo,
▼e Jeremiah Gayle,
▼e Joshua Ravich -
250
▼a 1st ed.
-
260
▼a Boca Raton, FL :
▼b CRC Press,
▼c 2022 -
300
▼a 289 p. ;
▼c 24 cm -
490
▼a Resilience and sustainability in civil, mechanical, aerospace and manufacturing engineering systems
-
504
▼a Includes bibliographical references and index
-
520
▼a "Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA's Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space"--
▼c Provided by publisher -
650
▼a Electronic packaging
-
650
▼a Electronic apparatus and appliances
▼x Reliability -
650
▼a Space vehicles
▼x Electronic equipment
▼x Design and construction -
650
▼a Extreme environments
-
700
▼a Cepeda-Rizo, Juan,
▼e author -
700
▼a Gayle, Jeremiah,
▼e author -
700
▼a Ravich, Joshua,
▼e author -
950
▼b US$120
-
LDR
- 바구니담기
- 내서재 담기
- 내보내기
상세정보
Thermal and structural electronic packaging analysis for space and extreme environments 1st ed
QR코드| 자료유형 : | 단행본 |
|---|---|
| ISBN : | 9781032160818 |
| 분류기호 : | TK7870.15 |
| 서명/저자사항 : | Thermal and structural electronic packaging analysis for space and extreme environments / Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich |
| 판사항 : | 1st ed. |
| 발행사항 : | Boca Raton, FL : CRC Press, 2022 |
| 형태사항 : | 289 p. ; 24 cm |
| 총서사항 : | Resilience and sustainability in civil, mechanical, aerospace and manufacturing engineering systems |
| 서지주기 : | Includes bibliographical references and index |
| 요약 : | "Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA's Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space"-- Provided by publisher |
| 일반주제명 : | Electronic packaging -- |
| 일반주제명 : | Electronic apparatus and appliances -- Reliability -- |
| 일반주제명 : | Space vehicles -- Electronic equipment -- Design and construction -- |
| 일반주제명 : | Extreme environments -- |
| 개인저자 : | Cepeda-Rizo, Juan, author |
| 개인저자 : | Gayle, Jeremiah, author |
| 개인저자 : | Ravich, Joshua, author |
| 언어 | 영어 |
예약
- 1. 예약현황은 홈페이지 로그인 후 예약 페이지에 확인 가능합니다.
- 2. 도착 통보된 예약자료 대출을 원하지 않는 경우에는 예약 현황에서 취소할 수 있습니다.
- 3. 기타 문의사항은 도서관에 문의 바랍니다.
무인예약대출
- 1. 무인예약대출 현황은 홈페이지 로그인 후 무인예약대출 페이지에 확인 가능합니다.
- 2. 무인예약대출자료 대출을 원하지 않는 경우에는 무인예약대출 페이지에서 신청 또는 접수상태인 경우만 취소할 수 있습니다.
- 3. 희망대출일은 신청일로부터 최대 1주일 까지 가능합니다.
- 4. 희망대출일을 선택하지 않은 경우 대출대기 통보 후 1주일까지 기기에서 대출가능합니다.
- 5. 기타 문의사항은 도서관에 문의 바랍니다.
서평쓰기