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RF and Microwave Module Level Design and Integration

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Book Detail
Data Type : eBook
ISBN : 178561360X 
ISBN : 9781785613609 
ISBN :
ISBN :
Personal Author : Almalkawi, Mohammad, author.
Title/Author : RF and Microwave Module Level Design and Integration /:  Mohammad Almalkawi. 
Imprint : London:  The Institution of Engineering and Technology,  2019. 
Format : 1 online resource (337 pages). 
Total Title Note : IET Materials, Circuits and Devices series;  34 
요약 : This book is intended to bring together fundamental concepts and elements needed in the design, integration, and characterization phases of modern radio frequency (RF) and microwave modules and to familiarize the interested reader with the common challenges in this rapidly changing field. While design for manufacturability (DFM) and design for testability (DFT) are two important practices that stress the need for careful attention at the early design stages of a product, module integration to achieve optimal RF performance is an art form that takes years to master. In this context, the objective of this book is to provide the necessary practical and theoretical background needed to tackle a multitude of issues accompanied by the design of contemporary RF modules. The topics covered can serve a broad range of individuals: those just entering the field, graduate-level students, and researchers, as well as practicing engineers seeking new domains to expand their knowledge, understand design tradeoffs, and looking for a quick guide in digesting the several aspects of the RF module design processes and their common challenges. The book comprises eight chapters which discuss: packaging, lumped and distributed passive elements, microwave network analysis, impedance matching networks, electromagnetic field couplings, CAD, components of RF front-end modules, component- and module-level measurements. 
General Subject Name : Computer-aided design. -- 
General Subject Name : Electric circuits. -- 
General Subject Name : Electric networks, Passive. -- 
General Subject Name : Electronic circuit design. -- 
General Subject Name : Electronic packaging. -- 
General Subject Name : Impedance matching. -- 
General Subject Name : Lumped elements (Electronics) -- 
General Subject Name : Microwave circuits. -- 
General Subject Name : Computer-aided design. -- 
General Subject Name : Electric circuits. -- 
General Subject Name : Electric networks, Passive. -- 
General Subject Name : Electronic circuit design. -- 
General Subject Name : Electronic packaging. -- 
General Subject Name : Impedance matching. -- 
General Subject Name : Lumped elements (Electronics) -- 
General Subject Name : Microwave circuits. -- 
General Subject Name : circuit CAD. -- 
General Subject Name : electromagnetic coupling. -- 
General Subject Name : electronics packaging. -- 
General Subject Name : impedance matching. -- 
General Subject Name : lumped parameter networks. -- 
General Subject Name : microwave circuits. -- 
General Subject Name : modules. -- 
General Subject Name : passive networks. -- 
기타형태 저록 : Print version:, 9781785613609
기타형태 저록 : Print version:, 1785613596, 9781785613593
Language English
Original text
URL :

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  5. 5. 기타 문의사항은 도서관에 문의 바랍니다.
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