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• LDR

  01183nam a2200241 u 4500

• 001

  000000354149

• 005

  20120927221435

• 008

  981016s1993 us a 001 eng

• 020

  ▼a  1567000150

• 049

  ▼a  KMAL
  ▼l  AZ0000180057
  ▼v  1

• 082

  ▼a  621.4022
  ▼2  20

• 090

  ▼a  621.4022
  ▼b  L51t

• 245

  ▼a  Transport phenomena in thermal engineering:
  ▼b  proceedings of the sixth international symposium on transport phenomena in thermal engineering (ISTP-VI), Seoul, Korea, May 9-13, organized under the auspices of pacific center of thermal-fluids engineering.
  ▼n  1/
  ▼d  edited by Joon Sik Lee, Suk Ho Chung, Ki Hyun Kim.

• 260

  ▼a  New York:
  ▼b  Begell House, Inc.,
  ▼c  1993.

• 300

  ▼a  xxii, 778p.:
  ▼b  ill.;
  ▼c  29cm.

• 504

  ▼a  Includes bibliographical references and indexes.

• 650

  ▼a  Heat
  ▼x  Transmission
  ▼x  Congresses.

• 650

  ▼a  Transport theory
  ▼x  Congresses.

• 650

  ▼a  Heat
  ▼x  Convection
  ▼x  Congresses.

• 653

  ▼a  TRANSPORT
  ▼a  PHENOMENA
  ▼a  IN
  ▼a  THERMAL
  ▼a  ENGINEERING
  ▼a  PROCEEDINGS
  ▼a  OF
  ▼a  THE
  ▼a  SIXTH
  ▼a  INTERNATIONAL
  ▼a  SYMPOSIUM
  ▼a  ON
  ▼a  ISTPVI
  ▼a  SEOUL
  ▼a  KOREA
  ▼a  MAY
  ▼a  913
  ▼a  ORGANIZED
  ▼a  UNDER
  ▼a  AUSPICES
  ▼a  PACIFIC
  ▼a  CENTER
  ▼a  THERMALFLUIDS

• 700

  ▼a  Lee, Joon Sik,

• 700

  ▼a  Chng, Suk Ho,

• 700

  ▼a  Kim, Ki Hyun,

• 991

  ▼a  단행본

• 090

  ▼a  621.4022
  ▼b  L51t