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05072cam a2200985Mi 4500
000000534497
20210114163242
m d
cr |n|||||||||
190724t20192019enk fo 000 0 eng d
▼a 1135941621
▼a 178561360X
▼a 9781785613609
▼q (electronic bk.)
▼z 1785613596
▼z 9781785613593
▼a 2339154
▼b (N$T)
▼a (OCoLC)1112093460
▼z (OCoLC)1135941621
▼a STF
▼b eng
▼e pn
▼c STF
▼d OCLCO
▼d UIU
▼d OCLCF
▼d CUS
▼d EBLCP
▼d OCLCQ
▼d UX1
▼d UKAHL
▼d YDX
▼d SFB
▼d N$T
▼d 248023
▼a TK6561
▼a B0120
▼2 inspec
▼a B0170J
▼2 inspec
▼a B1350
▼2 inspec
▼a 621.38411
▼a Almalkawi, Mohammad,
▼e author.
▼a RF and Microwave Module Level Design and Integration /:
▼c Mohammad Almalkawi.
▼a London:
▼b The Institution of Engineering and Technology,
▼c 2019.
▼a 1 online resource (337 pages).
▼a text
▼b txt
▼2 rdacontent
▼a computer
▼b c
▼2 rdamedia
▼a online resource
▼b cr
▼2 rdacarrier
▼a IET Materials, Circuits and Devices series;
▼v 34
▼a This book is intended to bring together fundamental concepts and elements needed in the design, integration, and characterization phases of modern radio frequency (RF) and microwave modules and to familiarize the interested reader with the common challenges in this rapidly changing field. While design for manufacturability (DFM) and design for testability (DFT) are two important practices that stress the need for careful attention at the early design stages of a product, module integration to achieve optimal RF performance is an art form that takes years to master. In this context, the objective of this book is to provide the necessary practical and theoretical background needed to tackle a multitude of issues accompanied by the design of contemporary RF modules. The topics covered can serve a broad range of individuals: those just entering the field, graduate-level students, and researchers, as well as practicing engineers seeking new domains to expand their knowledge, understand design tradeoffs, and looking for a quick guide in digesting the several aspects of the RF module design processes and their common challenges. The book comprises eight chapters which discuss: packaging, lumped and distributed passive elements, microwave network analysis, impedance matching networks, electromagnetic field couplings, CAD, components of RF front-end modules, component- and module-level measurements.
▼a Online resource; title from PDF title page (IET, viewed September 23, 2019).
▼a Added to collection customer.56279.3
▼a Computer-aided design.
▼a Electric circuits.
▼a Electric networks, Passive.
▼a Electronic circuit design.
▼a Electronic packaging.
▼a Impedance matching.
▼a Lumped elements (Electronics)
▼a Microwave circuits.
▼a Computer-aided design.
▼2 fast
▼0 (OCoLC)fst00872701
▼a Electric circuits.
▼2 fast
▼0 (OCoLC)fst00904545
▼a Electric networks, Passive.
▼2 fast
▼0 (OCoLC)fst00905350
▼a Electronic circuit design.
▼2 fast
▼0 (OCoLC)fst00906862
▼a Electronic packaging.
▼2 fast
▼0 (OCoLC)fst00907414
▼a Impedance matching.
▼2 fast
▼0 (OCoLC)fst00968089
▼a Lumped elements (Electronics)
▼2 fast
▼0 (OCoLC)fst01003679
▼a Microwave circuits.
▼2 fast
▼0 (OCoLC)fst01020171
▼a circuit CAD.
▼2 inspect
▼a electromagnetic coupling.
▼2 inspect
▼a electronics packaging.
▼2 inspect
▼a impedance matching.
▼2 inspect
▼a lumped parameter networks.
▼2 inspect
▼a microwave circuits.
▼2 inspect
▼a modules.
▼2 inspect
▼a passive networks.
▼2 inspect
▼a Electronic books.
▼i Print version:,
▼z 9781785613609
▼i Print version:,
▼z 1785613596,
▼z 9781785613593
▼w (OCoLC)1089417906
▼a Materials, circuits and devices series;
▼v 34.
▼3 EBSCOhost
▼u http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=2339154
▼a Askews and Holts Library Services
▼b ASKH
▼n AH35981911
▼a ProQuest Ebook Central
▼b EBLB
▼n EBL6026412
▼a YBP Library Services
▼b YANK
▼n 301049524
▼a EBSCOhost
▼b EBSC
▼n 2339154
▼a 강리원
▼a eBook
▼a 92
▼b N$T
| 자료유형 : | eBook |
|---|---|
| ISBN : | 178561360X |
| ISBN : | 9781785613609 |
| ISBN : | |
| ISBN : | |
| 개인저자 : | Almalkawi, Mohammad, author. |
| 서명/저자사항 : | RF and Microwave Module Level Design and Integration /: Mohammad Almalkawi. |
| 발행사항 : | London: The Institution of Engineering and Technology, 2019. |
| 형태사항 : | 1 online resource (337 pages). |
| 총서사항 : | IET Materials, Circuits and Devices series; 34 |
| 요약 : | This book is intended to bring together fundamental concepts and elements needed in the design, integration, and characterization phases of modern radio frequency (RF) and microwave modules and to familiarize the interested reader with the common challenges in this rapidly changing field. While design for manufacturability (DFM) and design for testability (DFT) are two important practices that stress the need for careful attention at the early design stages of a product, module integration to achieve optimal RF performance is an art form that takes years to master. In this context, the objective of this book is to provide the necessary practical and theoretical background needed to tackle a multitude of issues accompanied by the design of contemporary RF modules. The topics covered can serve a broad range of individuals: those just entering the field, graduate-level students, and researchers, as well as practicing engineers seeking new domains to expand their knowledge, understand design tradeoffs, and looking for a quick guide in digesting the several aspects of the RF module design processes and their common challenges. The book comprises eight chapters which discuss: packaging, lumped and distributed passive elements, microwave network analysis, impedance matching networks, electromagnetic field couplings, CAD, components of RF front-end modules, component- and module-level measurements. |
| 일반주제명 : | Computer-aided design. -- |
| 일반주제명 : | Electric circuits. -- |
| 일반주제명 : | Electric networks, Passive. -- |
| 일반주제명 : | Electronic circuit design. -- |
| 일반주제명 : | Electronic packaging. -- |
| 일반주제명 : | Impedance matching. -- |
| 일반주제명 : | Lumped elements (Electronics) -- |
| 일반주제명 : | Microwave circuits. -- |
| 일반주제명 : | Computer-aided design. -- |
| 일반주제명 : | Electric circuits. -- |
| 일반주제명 : | Electric networks, Passive. -- |
| 일반주제명 : | Electronic circuit design. -- |
| 일반주제명 : | Electronic packaging. -- |
| 일반주제명 : | Impedance matching. -- |
| 일반주제명 : | Lumped elements (Electronics) -- |
| 일반주제명 : | Microwave circuits. -- |
| 일반주제명 : | circuit CAD. -- |
| 일반주제명 : | electromagnetic coupling. -- |
| 일반주제명 : | electronics packaging. -- |
| 일반주제명 : | impedance matching. -- |
| 일반주제명 : | lumped parameter networks. -- |
| 일반주제명 : | microwave circuits. -- |
| 일반주제명 : | modules. -- |
| 일반주제명 : | passive networks. -- |
| 기타형태 저록 : | Print version:, 9781785613609 |
| 기타형태 저록 : | Print version:, 1785613596, 9781785613593 |
| 언어 | 영어 |
| URL : |
|---|
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